Plasma surface cleaning/activating is a process in which impurities and contaminants on the sample surface are removed as gaseous particles by creating high-energy plasma. Removal of contaminants from the surface of the studied substrates, without affecting the overall properties of the material, is an advantage of the surface cleaning method using plasma. Gases such as oxygen or argon are used for this purpose. High frequency voltage (in the range of kHz up to several MHz) is usually used to ionize these gases and create plasma. The plasma generated to clean the surface of the sample is usually formed in a vacuum (pressure of about 1 mbar). Of course, plasma is also used at atmospheric pressure in some cases. Plasma is produced with DC or RF voltage.
Technical specifications
Technical specifications | NM-PC-100 |
---|---|
User Panel | “ 4.3 :HMI |
Maximum vacuum pressure | 3e^-2 |
tank volume | 5L |
Power supply | 40KH(100w) |
Flow control | 2 manual flow control valves |
Accessories | Vacuum pump 8 m3 |
Gage vacuum | Ambient pressure up to 5 e-3 |
Pressure adjustment resolution | 5% FS |
Plasma space | The total volume of the chamber |
Chamber diameter | 20 cm |